June 24, 2024

Printed board assembly cleaning nozzles

PCB cleaning

Printed board assembly (PCB) cleaning is a crucial step that follows various chemical treatments such as etching, developing, and stripping. Cleaning ensures that any residual chemicals or contaminants are removed from the PCB surface, preventing potential issues such as corrosion, electrical shorts, or contamination of subsequent processes.

PCB cleaning before the polishing

The cleaning process before the polishing begins is an important step. The PCB surface needs to be thoroughly cleaned to remove any contaminants such as dust, oils, or residues left over from previous manufacturing steps.

For this cleaning process, we offer 3 different types of spray nozzles, all with an outstanding wear resistance due to their ceramic orifices.

Find them here:




PCB cleaning after the developing process

PCB cleaning after the developing process

Once the developing process is complete, the PCB should be cleaned thoroughly to remove any residual developing solution and to stop the development reaction. This step is crucial to prevent overdevelopment or underdevelopment of the photoresist.

For this rinsing process we have developed the INJJX series. The INJJX has a full-cone spraying pattern with a round impact area and uniform distribution. It has a quick-detachable design which helps to reduce maintenance time. It is available in polypropylene, which is highly chemical and heat resistant.

Find it here: INJJX series



PCB cleaning after etching process

During the etching process, the PCB is immersed in an etchant solution, typically containing chemicals such as ferric chloride or ammonium persulfate. This process continues until all unwanted copper has been removed. Once the etching process complete, the PCB is rinsed.


For this process we offer two types of spray nozzles which have been developed especially for the post-etching process; INJJX-Y and JJRP. Both spray nozzles are made of  polypropylene resin, which means that they have a very high  chemical resistance and heat resistance.

Find them here:


PCB cleaning after the etching process



PCB cleaning after the etching process

After the etching process, the stripping process takes place. This is the step where the remaining photoresist is removed from the PCB. For this process, we offer 4 different types of chemical resistant spray nozzles:


Blow-off after PCB cleaning 

Airblow in the PCB process is when compressed air is used to remove excess water, chemicals, or contaminants from the surface of the PCB. This process is typically employed after rinsing or cleaning steps to ensure that the PCB surface is thoroughly dried and free from residual moisture or contaminants before proceeding to the next manufacturing or assembly step. For this step we offer our TAIFUJet series, which is a line of compressed air nozzles. Their unique and compact design takes the surrounding air and multiplies the airflow, producing a powerful air blow with high spray impact, minimal air consumption and minimal noise levels. Find it here: TAIFUJet